"Sheet1"
"2010年第八届中国半导体封装测试技术与市场研讨会日程"
" 2010年6月24日(星期四) "
"全天参会代表及演讲人报到;下午二点在麒麟山庄一楼第二会议室开理事会"
"2010年6月25日(星期五)"
"全天大会报告;下午三点国家科技重大专项(02专项)在麒麟山庄一楼第二会议室召开座谈会,请接 到通知的代表准时出席"
" 上 午","主持人: 王红秘书长 "
,"开始","结束","内容","演讲人","单位","地点"
,"8:30","8:40","致辞","毕克允","中国半导体行业协会副理事长,封装分会理事长","麒麟山庄贵宾楼 B 区多功能厅"
,"8:40","9:50","领导讲话","许金寿","中国半导体行业协会常务副理事长"
,,,,"吕新奎","中国电子科技集团科技委主任,原全国政协委员,信息产业部副部长,中国电子科技集团总经理"
,,,,,"工信部电子信息司领导"
,,,,"叶甜春","国家科技重大专项(02专项)专家组组长,中科院微电子所所长"
,,,,,"深圳市政府领导"
,,,,"陆郝安","SEMI中国区总裁"
,"9:50","10:05","会场休息"
,"10:05","10:35","3D封装能否延续摩尔定律","许居衍","中国工程院院士"
,"10:35","11:05","中国如何产生世界级的封测企业","石磊","南通富士通微电子股份公司总经理"
,"11:05","11:35","电热共同设计电子封装的新需求","方家元","信真软件(上海)有限公司总经理"
,"11:35","11:55","陶瓷封装技术在新能源领域的应用","郑宏宇","中国电科第十三研究所副总工, 河北中瓷电子科技公司总经理"
,"11:55","13:00"," 午 餐(麒麟阁) "
"下 午","主持人;裴二章副秘书长"
,"13:00","13:30","晶圆级封装工艺与设备","刘宝龙","格兰达技术(深圳)有限公司","麒麟山庄贵宾楼 B 区多功能厅"
,"13:30","14:00"
,,,"系统级封装技术(SiP)引领封测产业的"混搭"潮","陈一杲","长电科技股份有限公司"
,"14:00","14:30","千住金属的综合焊接技术","雷 金平 亀田 直人","千住金属工业株式会社"
,"14:30","15:00","半导体热管理电子材料的挑战和趋势","陈田安","霍尼韦尔电子材料部"
,"15:00","15:30","3D X光断层扫描检查技术","KISHI","岛津国际贸易(上海)有限公司"
,"15:30","15:45","会场休息"
,"15:45","16:15","薄片研磨与切割的新趋势","Liew Loy Seng","迪思科科技中国有限公司"
,"16:15","16:45","Advancements In Packaging Technology Driven By Global Market Return","Renyi Wang, Ph.D.","汉高股份有限公司"
,"16:45","17:15","华测 -- 集成电路产业链发展推动者","徐江","深圳华测检测技术股份有限公司"
,"17:15","17:45","三维封装- 半导体设备的新挑战","龚里","苏斯贸易(上海)有限公司"
,"17:45","18:00","超声扫描检测技术在半导体封装中的应用","姚立新","中国电科第四十五研究所"
,"18:00","18:30","微焊点自动光学显微检测仪(MMI)在3D封装中的应用","严仕新","苏州德天光学技术有限公司"
,"19:00","20:30","晚 宴(麒麟阁)"
" 2010年6月26日(星期六)"
" 上午","主持人:王春青副理事长"
,"8:30","9:00","TSV技术在中国实践","万里兮","中科院微电子所","麒麟山庄贵宾楼 B 区多功能厅"
,"9:00","9:30","薄膜辅助封装技术","王林根","Boschman Technologies "
,"9:30","10:00","Mentor Graphics 先进的 SiP/Package 解决方案","李扬","奥肯思公司"
,"10:00","10:15","会场休息"
,"10:15","10:45","先进LGA-SiP封装技术","郭小伟","天水华天股分有限公司"
,"10:45","11:15","纳米级X射线管以及纳米CT: 亚微米级的IC封装内部微小连接的检测. ","温泉","上海海乐电子科技有限公司"
,"11:15","11:45","化学镀镍钯金改善铜线键合良率","水玉洋","安美特(中国)化学有限公司"
,"11:45","12:15","电子元器件包装材料未来发展趋势","王海龙","3M中国有限公司"
,"12:15","13:15","午餐(麒麟阁)"
" 下 午","主持人:赵勃副秘书长"
,"13:15","13:35","先进MEMS & CMOS晶圆级立体封装:晶圆工艺开发和代工服务 ","黄河","中芯国际集成电路制造有限公司"
,"13:35","14:05","硅通孔工艺开发的挑战与解决方案","史训清","香港应用科学研究院","麒麟山庄贵宾楼 B 区多功能厅"
,"14:05","14:35","先进有机封装基板技术","谷新","深南电路有限公司"
,"14:35","15:05","科技铸精品,创新启未来—— 无铅环保焊锡球 ","顾云杰","大丰宙新电子有限公司"
,"15:05","15:30","次世化电子封装--趋势与挑战","赖逸少","日月光半导体"
,"15:30","16:00","X射线荧光分析 在半导体封装领域的最新应用","王奇","精工盈司电子科技(上海)有限公司"
,"16:00","16:15","会场休息"
,"16:15","16:45","PVA超声波扫描显微镜新产品介绍","Albert Lin","科视达(中国)有限公司"
,"16:45","17:15","BGA锡球的开发及其应用","王彰盟","升贸科技股份有限公司"
,"17:15","17:45","CATT系列超大规模混合信号集成电路(SOC)测试系统","徐泽群","北京冠中集创科技有限公司"
,"17:45","18:15","Moldflow在封装成型领域的应用 ","李建 ","上海湃睿信息科技有限公司"
,"18:15","18:40","Emerging Package Technology in South China","Edward then","UTAC (DG) Ltd"
,"19:00","20:00"
"2010年6月27日(星期日)"
"上 午","8:30","13:30","文化考察:参观深南电路有限公司,格兰达技术(深圳)有限公司, 深圳华测检测技术股份有限公司, STM意法半导体公司,深圳方正微电子有限公司"
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"锦 绣 中 华 厅
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"锦 绣 中 华 厅
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"Sheet2"
"Sheet3"