http://www.xinpian.net/Altera/epm570g.pdf

EPM570 EPM570G 570 440 240 to 570 8,192 160 5.4 304 1.2 4.5
EPM1270 EPM1270G 1,270 980 570 to 1,270 8,192 212 6.2 304 1.2 4.6
EPM2210 EPM2210G 2,210 1,700 1,270 to 2,210 8,192 272 7.0 304 1.2 4.6
EPM240Z 240 192 128 to 240 8,192 80 7.5 152 2.3 6.5
EPM570Z 570 440 240 to 570 8,192 160 9.0 152 2.2 6.7
f
For more information about equivalent macrocells, refer to the MAX II Logic Element to Macrocell Conversion Methodology white paper. MAX II and MAX IIG devices are available in three speed grades: –3, –4, and –5, with –3 being the fastest. Similarly, MAX IIZ devices are available in two speed grades: –6, –7, with –6 being faster. These speed grades represent the overall relative performance, not any specific timing parameter. For propagation delay timing numbers within each speed grade and density, refer to the DC and Switching Characteristics chapter in the MAX II Device Handbook. Table 1–2 shows MAX II device speed-grade offerings.
Table 1–2. MAX II Speed Grades Speed Grade Device EPM240 EPM240G EPM570 EPM570G EPM1270 EPM1270G EPM2210 EPM2210G EPM240Z EPM570Z — — — — — — v v v v v v v — — v v v — — v v v — — –3 v –4 v –5 v –6 — –7 —
MAX II Device Handbook
October 2008 Altera Corporation
http://www.xinpian.net
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Chapter 1: Introduction Features
1–3
MAX II devices are available in space-saving FineLine BGA, Micro FineLine BGA, and thin quad flat pack (TQFP) packages (refer to Table 1–3 and 1–3). MAX II devices support vertical migration within the same package (for example, you can migrate between the EPM570, EPM1270, and EPM2210 devices in the 256-pin FineLine BGA package). Vertical migration means that you can migrate to devices whose dedicated pins and JTAG pins are the same and power pins are subsets or supersets for a given package across device densities. The largest density in any package has the highest number of power pins; you must lay out for the largest planned density in a package to provide the necessary power pins for migration. For I/O pin migration across densities, cross reference the available I/O pins using the device pin-outs for all planned densities of a given package type to identify which I/O pins can be migrated. The Quartus II software can automatically cross-reference and place all pins for you when given a device migration list.

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