MAX II Device Handbook
October 2008 Altera Corporation
http://www.xinpian.net
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2. MAX II Architecture
MII51002-2.2
Introduction
This chapter describes the architecture of the MAX II device and contains the following sections:
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"Functional Description" on page 2–1 "Logic Array Blocks" on page 2–4 "Logic Elements" on page 2–6 "MultiTrack Interconnect" on page 2–12 "Global Signals" on page 2–16 "User Flash Memory Block" on page 2–18 "MultiVolt Core" on page 2–22 "I/O Structure" on page 2–23
Functional Description
MAX II devices contain a two-dimensional row- and column-based architecture to implement custom logic. Row and column interconnects provide signal interconnects between the logic array blocks (LABs). The logic array consists of LABs, with 10 logic elements (LEs) in each LAB. An LE is a small unit of logic providing efficient implementation of user logic functions. LABs are grouped into rows and columns across the device. The MultiTrack interconnect provides fast granular timing delays between LABs. The fast routing between LEs provides minimum timing delay for added levels of logic versus globally routed interconnect structures. The MAX II device I/O pins are fed by I/O elements (IOE) located at the ends of LAB rows and columns around the periphery of the device. Each IOE contains a bidirectional I/O buffer with several advanced features. I/O pins support Schmitt trigger inputs and various single-ended standards, such as 66-MHz, 32-bit PCI, and LVTTL. MAX II devices provide a global clock network. The global clock network consists of four global clock lines that drive throughout the entire device, providing clocks for all resources within the device. The global clock lines can also be used for control signals such as clear, preset, or output enable.
October 2008
Altera Corporation
MAX II Device Handbook
http://www.xinpian.net

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